BOBST

Substrate processing Vacuum Metallizing K4000 CRUCIBLE Metallizer

Substrate processing Vacuum Metallizing K4000 CRUCIBLE Metallizer

Low defect metallizing

Cost effective crucible technology

• Based on the successful K4000 platform
• Crucible technology for low defect metallized film
• Low consumable costs due to low cost of metal ingots in comparison to wire
• Largest coating window In the industry with improved collection efficiency of 16%
• Suitable for a wide variety of applications including high barrier food packaging and yarn.

Repeatable performance

• 90%* reduction in the number of pinholes with a repeatable, reliable performance
• Excellent deposition quality and uniformity
• Easier to set up and consequently easier for less experienced operators to run.

Superior winding

• Incorporates the BOBST renowned winding mechanism
• Virtually wrinkle-free film
• Designed to handle heat stable and heat sensitive substrates
• Can metallize a wide variety of materials including Al, Ag, Cu and ZnS.