32, Gongdan 1Daero#79gil, Shiheung-Si Kyungki-Do, Korea. ZIP.15085
Build Up Board
Build Up method is piling the layers and making the pattern at once. Also make the micro hole in inner layer as it needs for conducting.
Proto type Board
Can produce with various surface finishing and different color for Solder masking.
Sincerely Plantautomation Technology
Regards,
Client Success Team (CRM),
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