Amphenol Ltd

Thanet Way, Whitstable, Kent, CT5 3JF, UK

Electronic Assemblies

Capabilities include automated select solder, press-fit, and hand solder for through hold, single and double-sided BGA's and uBGA's, high-density packages, chip on board, lead-free, and conformal coating (UR, UL, Parylene). Process validation capabilities: 3D Solder Paste Inspection (SPI), Pre and Post-Reflow Automated Optical Inspection (AOI), 3D X-ray, and aqueous and non-aqueous cleaning.

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