Accumet Engineering, Inc.

Accumet Engineering, Inc.

123 Oak Hill Rd Westford, MA 01886

Laser Drilling Service

Laser Drilling Service

Laser Drilling Service

Our laser drilling services leverage our precision laser expertise to provide highly efficient and rapid drilling of small holes in a wide variety of materials and PCBs, including ceramic substrates, metals, plastics, glass, and semiconductors. Our laser drilling service enables no-contact drilling--from thousands of micro-holes in ceramics and stainless steel, PCB vias and through-holes. When considering laser drilling of glass and PCBs vs. electrical discharge machining, or EDM, laser drilling is much more precise. And compared to other machine drilling techniques, laser drilling doesn’t require tooling that wears down and thus reduces repeatability. At Accumet, a wide range of laser drilled hole diameters is possible in the same job without retooling, and we're capable of very large, depth-to-diameter ratios with excellent consistency. Also, our laser drilling service is ideal for angled, curved, and inconsistent surfaces, as well as materials of virtually any hardness. 

Laser Drilling Semiconductor Materials like Silicon (Si), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Carbide (SiC) and more.

Many glass and semiconductor materials are used in the latest microelectronics and our precision laser drilling is employed to process holes in these very thin and delicate sheets and wafers. In contrast, machine drilling, such as with a wire EDM, CNC, or other mechanical drilling operation, often apply too much pressure resulting in cracks, stress fractures, and reduction of lot yields. Moreover, the excessive heat generated during machine drilling can cause edge melting and thermal cycling that weakens the glass or semiconductors and may change its electrical and physical properties.

One major benefit of laser drilling is that it provides a non-contact machining for developing large, and even laser-drilled micro-holes, which has a very small, heat-affected zone (HAZ). Hence, with laser drilling the threat of cracking, stress fractures, melting, and thermal cycling of a glass or semiconductor is extremely low. Moreover, laser drilling relies on the same precision-positioning systems as the latest CNC and machine-drilling technologies, but has virtually no vibration and tool wobble. This allows for laser-drilling machines to provide enhanced reliability, repeatability, and consistency from job to job.

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