AccreTech Group

Blade dicer SS10

Blade dicer SS10

Semi-automatic Dicer Machine from the new Small Footprint Generation.

Low space requirement

High flexibility

High speed

Low scrap production

• Smallest and quickest 6 inch Dicing Machine in the world
• Suitable for various types of wafers
• Image preparation processor automatically adapts to the different wafers
• High Performance Spindle with 60,000 rpm
• 14-Inch Touch Panel and new Graphical User Interface
• Microscope with High Resolution
• Easy & simple kerf check function
• Simple operation with 17-Inch Touch Panel and new Graphical User Interface