Press Releases
ROGERS, Minn., Jan. 24, 2019 /PRNewswire/ -- Automatic loading and unloading of large parts for digital X-ray inspection is now available on the larger Computed Tomography systems manufactured by North Star Imaging (NSI). NSI's robotiX:
Read more...SHENZHEN, China, Jan. 24, 2019 /PRNewswire/ -- Ionix Technology, Inc. ("IINX", same as ticker symbol), announced today that Mr. Bailiang Yang has been appointed as the chairman of the board of directors, and Mr. Jialin Liang and Ms. Xuemei Jiang have been appointed as members of the board of directors.M
Read more...AUSTIN, Texas, and LONDON, Jan. 24, 2019 /PRNewswire/ -- Blue Prism (AIM: PRSM) announced earlier today a placing of shares with ne
Read more...20 March 2019
SAN JOSE, Calif., Jan. 24, 2019 /PRNewswire/ -- Intermolecular, Inc. (NASDAQ: IMI), the trusted partner for advanced materials innovation,
Read more...SAN JOSE, Calif., Jan. 23, 2019 /PRNewswire/ -- Xilinx, Inc. (Nasdaq: XLNX) today announced record revenues of $800 million for the third quarter of fiscal year 2019, up 7% from the prior quarter and up 34% year over year. GAAP net income for the December quarter was $239 million, or $0.93
Read more...20 March 2019
NEW YORK, Jan. 23, 2019 /PRNewswire/ -- MetaShield LLC, an innovator in the field of advanced materials, today announced the launch of MetaShieldCLEANTM, a fully transparent, nanotechnology-based coating that repels a significant amount of the stains, dust and dirt which typically accumulate on consumer packaging during ordinary use. The patent-pending co
Read more...DALLAS, Jan. 23, 2019 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NASDAQ: TXN) today reported fourth-quarter revenue of $3.72 billion, net income of $1.24 billion and earnings per share of $1.27. Earnings per share include a 1 cent
Read more...20 March 2019
BOSTON, Jan. 23, 2019 /PRNewswire/ -- Bestselling author and leading futurist Tom Koulopoulos has teamed up with Wasabi hot cloud storage CEO and serial entrepreneur David Friend to provide business leaders with a clear and straightforward understanding of the incredible power of the cloud a
Read more...20 March 2019
BROOKLYN, N.Y., Jan. 23, 2019 /PRNewswire/ -- An international team of researchers has reported a breakthrough in fabricating atom-thin processors – a discovery that could have far-reaching impacts on nanoscale chip production and in labs across the globe where scientists are exploring 2D materials for ever-smaller and -faster semiconductors.
Read more...20 March 2019
DAVOS, Switzerland, January 23, 2019 /PRNewswire/ --Edgybees, a leader in advanced, collaborative, visual intelligence technology, and HCL Technologies Ltd., a leading global technology company, today announced that they are hosting l
Read more...20 March 2019
ROME, January 23, 2019 /PRNewswire/ --iKO Media Group, a global end-to-end service provider for broadcasters and international content producer, distributor and channel operator Blue Ant Media have joined forces to expand distribution for four channels via INTELSAT 11 providing satellite coverage across Latin America. This expansio
Read more...20 March 2019
BOSTON, Jan. 23, 2019 /PRNewswire/ -- Recorded Future, the leading threat intelligence company, today announced the availability of a new offering: Third-Party Risk. The new module will expose, contextualize, and rate the potential threat environment facing specific external organizations. Security teams using Recorded Future and its new Third-Party Risk module will
Read more...20 March 2019
DALLAS, Jan. 22, 2019 /PRNewswire/ -- Alok Sarsidharan, Director of Business Development, represented Re-Teck at CES 2019 in Las Vegas. The annual technology show brings together more than 188,000 industry professionals representing some of the world's largest technology companies and included more than 4500 exhibiting companies.
Read more...20 March 2019
PLEASANTON, Calif. and OBERKOCHEN, Germany, Jan. 23, 2019 /PRNewswire/ -- ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages. The new ZEISS systems include the Xradia 600-series Versa and Xradia 800 U
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