Teledyne LeCroy Adds PCI Express 5.0 Physical-Layer Testing
20 March 2019
SANTA CLARA, Calif., Jan. 30, 2019 /PRNewswire/ -- Teledyne LeCroy today announces support for PCI Express 5.0 physical layer testing with an advantage in calibration and test completion time, expanding on what is already an extensive set of PCI Express test solutions.
Demand for higher throughput in storage devices and data centers requires data-transfer rates higher than PCIe 4.0's 16 GT/s. Therefore, PCIe 5.0, at 32 GT/s, is expected to see rapid adoption. Teledyne LeCroy, an industry leader for PCI Express test equipment, now extends its physical-layer test domain to enable that adoption. The new Teledyne LeCroy QPHY-PCIE5-TX-RX physical-layer software option for LabMaster 10Zi-A series oscilloscopes provides:
- Automated receiver-test calibration for jitter-tolerance testing at the full 32 GT/s PCIe 5.0 rate. While existing solutions can take up to a full day to calibrate before even starting the test, the Teledyne LeCroy calibration will be completed in a fraction of that time.
- Automated collection of waveforms and testing of PCIe 5.0 transmitter parameters to significantly speed and simplify test throughput.
- Support for characterization of PCIe signals in both common-clocked and independently-clocked (SRIS/SRNS) architectures, linking Teledyne LeCroy's SDAIII-CompleteLinQ jitter-decomposition, eye-diagram, and noise-analysis software with new capabilities for faster PCIe 5.0 debug.
See a demonstration of the QPHY-PCIE5-TX-RX software with a LabMaster 10-65Zi-A, 65 GHz oscilloscope and an Anritsu Signal Quality Analyzer (SQA) MP1900A BERT at DesignCon 2019 in Santa Clara, CA in Teledyne LeCroy booth #519.
About Teledyne LeCroy
Teledyne LeCroy is a leading manufacturer of advanced oscilloscopes, protocol analyzers, and other test instruments that verify performance, validate compliance, and debug complex electronic systems quickly and thoroughly. Since its founding in 1964, the Company has focused on incorporating powerful tools into innovative products that enhance "Time-to-Insight". Faster time to insight enables users to rapidly find and fix defects in complex electronic systems, dramatically improving time-to-market for a wide variety of applications and end markets. Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy's website at teledynelecroy.com.
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and two-day expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: www.designcon.com. DesignCon is organized by UBM, which in June 2018 combined with Informa PLC to become a leading B2B information services group and the largest B2B Events organizer in the world. To learn more and for the latest news and information, visit www.ubm.com and www.informa.com.
© 2019 by Teledyne LeCroy. All rights reserved. Specifications are subject to change without notice.
Technical contact: Patrick Connally – Product Manager – (845) 425-2000
Customer contact: Teledyne LeCroy Customer Care Center – (800) 553-2769
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SOURCE Teledyne LeCroy