SAN JOSE, Calif., Nov. 28, 2018 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announces that its industry leading Thermal Test Chip (TTC) will soon be available in 8" (200mm) diameter wafers. This conversion is taking place because – Industry is better able to handle 8" wafers for bumping, thinning, and sawing Nu Read more...
Global Building Thermal Insulation Market size is estimated to garner the market value around USD 40 billion by 2026 with rising CAGR of 4.5% Over 2019-2026. LOS ANGELES, May 29, 2019 (GLOBE NEWSWIRE) -- Acumen Research and Consulting, a global provider of market research studies, in a rec Read more...
COLUMBIA, Mo., June 28, 2019 /PRNewswire/ -- WINDGO, Inc., a research and development company specializing in smart material and vibrational transfer technologies, announced today that they are expanding their thermal coatings into airflow systems based on multiple patents in their nanotechnology coatings patent portfolio. Based on recent advancements related to air Read more...
