SAN DIEGO, Oct. 28, 2020 (GLOBE NEWSWIRE) -- 3DElastoPrint is enabled by an elastomeric TPA, co-branded by Evonik and HP -- a flexible, high-performance, thermoplastic elastomer optimized specifically for HP’s Multi Jet FusionTM (MJF) 3D printer. Evonik and HP’s just released TPA material is flexible and lightweigh Read more...
SAN DIEGO, Dec. 17, 2018 /PRNewswire/ -- Qualcomm Technologies, Inc. a subsidiary of Qualcomm Incorporated, today announced its next-generation modem purpose-built for Internet of Things (IoT) applications such as asset trackers, health monitors, security systems, smart city sensors and smart meters, as well as a range of wearable trackers. The new Qualcomm® 9 Read more...
LAS VEGAS, Jan. 4, 2019 /PRNewswire/ -- Consumer Electronics Show -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, announced today CEVA-BX, its new all-purpose, hybrid DSP / Controller architecture to address new algorithms of digital signal processing in Read more...
