Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received a follow-on order from one of the largest foundries in Asia for its LSA101 laser spike anneal system. This win extends the company's leadership position in Asia and builds on the existing installed base of Ultratech's LSA systems currently utilized at multiple sites by this foundry customer. The LSA101 system, which will be used for 28-nm production is expected to ship in the first quarter of 2016.
"Historically, the semiconductor industry's growth depended on a reduction in cost per transistor with each migration to smaller nodes, but this cost reduction trend wasn't realized with the shrink below 28nm. This is one of the most serious challenges the industry has faced in the last 20-30 years. As such, a number of foundries are expanding their 28-nm capacity to capitalize on end customers that will benefit from moving to the optimal performance/cost delivered at this node. Going forward, leading technologies such as LSA are essential to meet the requirements for future device scaling," according to Dr. Handel H. Jones, founder and CEO of International Business Strategies, Inc.
Arthur W. Zafiropoulo, Ultratech Chairman and Chief Executive Officer, said, "The industry is experiencing a second wave of growth driving the 28-nm logic manufacturing arena. This order is another example of this growth, which is expected to continue driven by Asia's internal high demand for low-cost chips for mobile devices. As the production requirements for 28-nm processing continues, Ultratech is working closely with our customers to help them meet this demand. We value our strong relationships with our global customer base and work to provide advanced technology solutions that meet our customers' product roadmaps, along with strong local support teams to enable high-volume production ramps."
Ultratech Laser Spike Anneal Systems
Built on the customizable Unity Platform™, the LSA scanning systems have fundamental advantages in uniformity and low-stress processing. The systems' short dwell time capability, along with excellent process control, delivers superior within-die uniformity and layout-independent process results allowing customers to achieve improved device performance, lower leakage, and improved yield. Ultratech's flagship platform, the LSA101, delivers high flexibility and extendibility for advanced annealing applications and is currently in high-volume production for 28-nm and below logic devices.
This release includes forwardlooking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forwardlooking statements can generally be identified by words such as "anticipates," "expects," "remains," "thinks," "intends," "believes," "estimates," and similar expressions and include management's current expectation of its longer term prospects for success. These forwardlooking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forwardlooking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers? quarterly revenue fluctuations? industry and sector cyclicality, instability and unpredictability? market demand for consumer devices utilizing semiconductors produced by our clients? our ability to manage costs? new product introductions, market acceptance of new products and enhanced versions of our existing products? reliability and technical acceptance of our products? our lengthy sales cycles, and the timing of system installations and acceptances? lengthy and costly development cycles for laserprocessing and lithography technologies and applications? competition and consolidation in the markets we serve? improvements, including in cost and technical features, of competitors' products? rapid technological change? pricing pressures and product discounts? our ability to collect receivables? customer and product concentration and lack of product revenue diversification? inventory obsolescence? general economic, financial market and political conditions and other factors outside of our control? domestic and international tax policies? cybersecurity threats in the United States and globally that could impact our industry, customers, and technologies? and other factors described in our SEC reports including our Annual Report on Form 10K filed for the year ended December 31, 2015 and our Quarterly Report on Form 10-Q filed for the quarterly period ended October 3, 2015. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forwardlooking statements to reflect any event or circumstance that may arise after the date of this release.
Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: frontend semiconductor, backend semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
Source : prnewswire.com