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SICK Introduces UD18-2 Ultrasonic Sensor for Double Layer and Splice Detection

Thursday, May 05, 2016
SICK Introduces UD18-2 Ultrasonic Sensor for Double Layer and Splice Detection

SICK, one of the world’s leading manufacturers of sensors, safety systems, machine vision, encoders and automatic identification solutions for factory, logistics, and process automation, today announced the UD18-2 ultrasonic sensor for double layer and splice detection.

The UD18-2 checks for double layers and splices using ultrasonic technology. The sensor is able to determine whether one, two or no material layers are present between its sender and receiver. The UD18-2 can reliably detect objects regardless of material, including paper, cardboard, shiny metal, transparent plastic, and more.

The UD18-2 also features the capability to teach-in up to four sensitivity levels, and the sensor can switch between sensitivity levels during operation. This allows the sensor to tackle complex applications and ensure permanent system availability with consistent production quality.

In addition, the UD18-2 features rapid commissioning thanks to plug-and-play technology as well as variable mounting distance for flexibility during installation. It also features LEDs visible from any direction, making it easy to monitor double sheet detections. The UD18-2 is also immune to dirt, dust, and humidity, making it well-suited for a wide variety of applications in the packaging, print and paper, electronics and solar, automotive, and metal and steel industries.

In addition to the standard functionality, installers can also elect to use the optional Connect+ tool to unlock additional features within the UD18-2. For example, the Connect+ tool enables the configuration of additional filters and output modes such as on-delay timers, off-delay timers, and inverted output signals. The tool also provides a handy visualization of sensor behaviors and levels to help optimize performance.

 

Source : sick.com

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