Precision vision systems power Micro-LED bonding and HBM packaging

As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology‑leading company Micraft Systems Plus has developed two cutting-edge systems that meet these demands: the uLED Laser Soldering Machine and the HBM High-Accuracy Die Bonder. Both rely on industrial cameras from the USB 3 uEye CP series from IDS Imaging Development Systems to deliver maximum accuracy, speed, and process control. These systems are already in high-volume use across the Asian electronics market.

Application 1: Micro LED transfer and laser soldering with 20MP USB 3 uEye CP cameras

The uLED Laser Soldering Machine is designed for high-speed, precise of Micro-LEDs onto large-area substrates including G4.5 and G6 glass panels. Laser soldering minimizes thermal and mechanical stress, which is essential when handling thousands of miniature components simultaneously.

Firstly, the cameras are used to capture global reference marks for the preliminary alignment or to determine the rough position of the substrate in the machine coordinate system. This position data is then transmitted to the motion control system, which enables high-precision motion control on this basis - with a repeat accuracy of the coordinates of around ±1 μm.

Once qualified, the chips are aligned and transferred with extreme precision. For fine adjustment, the cameras now capture fiducial marks, enabling real-time sub-micrometer alignment of the substrate and, if necessary, dynamic rotation correction. The alignment results are then transmitted to the motion control system, which adjusts the stage position and angle to ensure each Micro-LED is perfectly matched to the target location. With a throughput rate of up to 10 million chips per hour, the system delivers both exceptional accuracy and high-volume efficiency, a key performance indicator (KPI) for scalable mass production.

This is followed by an inline inspection: The camera automatically moves to the relevant area, enabling operators to perform an initial inline visual inspection - such as verifying chip alignment, detecting potential tilt, and checking for physical damage or placement errors.

Download Link 1757480904-see-align-place.pdf