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KLA Corporation announced the launch of the revolutionary Axion T2000 X-ray metrology system for advanced memory chip manufacturers. Fabrication of 3D NAND and DRAM chips involves precise formation of extremely tall structures with deep, narrow holes and trenches, and other intricate architectural shapes – all requiring control at the nanoscale level. The Axion T2000 features patented technologies that power its ability to measure high aspect ratio device features with Read more...

PLEASANTON, Calif. and OBERKOCHEN, Germany, Jan. 23, 2019 /PRNewswire/ -- ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages. The new ZEISS systems include the Xradia 600-series Versa and Xradia 800 U Read more...