Winonics Brea

ULTRA FINE PITCH PCB

ULTRA FINE PITCH PCB

Winonics provides engineering and manufacturing support for Fine Pitch and Ultra-Fine Pitch PCBs used in high-density applications.

Fine Pitch PCBs are characterized by finer pitch features including narrower conductor widths and spacing that are required for designs using ultra-fine pitch BGAs and higher I/O count components.

Winonics capabilities include traditional dog bone fanouts as well as advanced technology via in pad construction. Via in pad technology enables much tighter routing required for Ultra-Fine Pitch BGAs devices.

Capabilities:

• Engineering and Manufacturing support for Ultra-Fine Pitch PCB designs
• Via in pad enabled fanouts
• Conductor widths down to 75µm
• Conductor widths below 50µm utilizing ACT-SAP advanced manufacturing technologies