Interplex,  a world leader in the design and manufacture of mechanical and interconnect products, is successfully addressing the growing market demand for high-density interconnects for challenging application scenarios. The company has just introduced its multi-row board-to-board  connectors . Thanks to its patented pressure cake design, this ingenious interconnection concept will revolutionize the industry, as it allows multiple connector units to be stacked. This means that interconnects can be sized appropriately while avoiding the need for custom fabrication. The original and cost-effective approach that Interplex has taken will allow different pin count requirements to be addressed through the same basic interconnect platform, without any additional engineering expense or effort.

The new multi-row board-to-board connectors feature 0.4mm miniPLX™ press-fit pins  , eliminating the need for soldering. These pins are made from a copper alloy and have very low levels of contact resistance. Each pin has a current carrying capacity of 3A. Optional coating of these pins with the company's patented IndiCoat™ plating technology mitigates tin filament buildup, preventing the risk of short circuits and extending life.

Interplex's multi-row board-to-board connectors are available in board stacking heights from 7mm to 30mm. They can have between one and six rows, with up to 30 contact terminals built into each row. Conforming to automotive performance requirements, these rugged products can withstand high levels of humidity (8 hour cycle up to 10% Rh), shock (35g for 5-10ms on 10 axes) and vibration (8 hours per axis). Withstands an operating temperature range of -40°C to +150°C.

"Being able to fit enough interconnect terminal pins in small spaces, without having any excess, is a top priority for any of our customers. At the same time, keeping the total cost of ownership low is also vital," explains Ralph Semmeling, director of the product portfolio including custom connectors at Interplex. "This means that the companies we do business with are looking to have access to off-the-shelf products at attractive prices, but with the inherent flexibility of following a customization-based strategy. Our new stackable interconnect platform gives them the best of both worlds." , allowing them to design with measured costs."

There are a wide variety of ideal applications for multi-row board-to-board connectors that are robust, high-density, and scalable. Among the most prominent are electric vehicles (EVs), especially for electric power steering functions and electronic control units. Opportunities also exist for these connectors to be used in industrial automation systems (such as robots), transportation hardware (trains), medical instrumentation (such as image scanners), etc.

For more information on Interplex's multi-row board-to-board connectors, visit https://interplex.com/ds/multi-row-board-to-board-connectors/ .

About Interplex
Interplex, a world leader in the design and manufacture of interconnects and mechanical products, seeks to solve complex design-from-the-source challenges for the electric mobility and information and communications markets, as well as medical and life sciences. We create value by helping our customers reduce their total cost of ownership, and we do this by leveraging our unique multidisciplinary expertise established in both electromechanical and mechanical disciplines. Headquartered in Singapore, Interplex has more than 13,000 employees in 33 plants and 13 countries where all its activities are carried out in a socially responsible manner, with minimal impact on the environment.
Learn more at www.interplex.com

Press contact:
Interplex
Marcella Saracco
marcella.saracco@ fr.interplex.com
00 33677562669

Agency Contact:
Publitek
Erin McMahon
erin.mcmahon@publitek.com
001 630.962.7535

Photography: https://mma.prnewswire.com/media/1948671/Interplex.jpg

FUENTE Interplex

 

Source:prnewswire.com

 

 

 

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