PLEASANTON, Calif. and OBERKOCHEN, Germany, Jan. 23, 2019 /PRNewswire/ -- ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages. The new ZEISS systems include the Xradia 600-series Versa and Xradia 800 U Read more...
PLEASANTON, Calif., and OBERKOCHEN, Germany, Sept. 17, 2019 /PRNewswire/ -- ZEISS today introduced the ZEISS Xradia 620 Versa RepScan® – a submicron-resolution, 3D non-destructive imaging solution for inspection and measurement that accelerates time to market for advanced IC packages. Utilizing 3D X-ray microscop Read more...
SHANGHAI, March 20, 2019 /PRNewswire/ -- Today at Semicon China 2019, Thermo Fisher Scientific unveiled its latest and most advanced focused ion beam scanning electron microscope (FIB-SEM) for nanometer scale materials characterization and analysis, the Thermo Scientific Helios 5 DualBeam microscope. The Helios 5 DualBeam FIB-SEM will be available in HX, FX and UX c Read more...
