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ST. FLORIAN, Austria, June 11, 2019 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today unveiled the HERCULES® NIL 300 mm—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's proprietary SmartNIL Read more...

TEL AVIV, Israel, Dec. 18, 2019 /PRNewswire/ -- SafeRide™ Technologies, the first company to offer a multi-layer and holistic anomaly detection and threat prevention solution, and NXP® Semiconductors today announced the integration of vSentry™ Edge AI – an embedded be Read more...

HSINCHU, Taiwan, Nov. 14, 2018 /PRNewswire/ -- MPI Corporation introduces a new 300 mm fully-automatic TS3500 wafer probe systems series with WaferWallet™. Over the past decade, the semiconductor industry has been challenged with increasing demands for accurate on-wafer measurements for Device Characterization during the Modeling and New Technology Develop Read more...