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MOUNTAIN VIEW, Calif., Dec. 6, 2018 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced that Atmosic Technologies (Atmosic™), an innovator of ultra-low-power wireless for the Internet of Things (IoT), has integrated CEVA's RivieraWaves Read more...

SANTA CLARA, Calif., Jan. 30, 2019 /PRNewswire/ -- Teledyne LeCroy today announces support for PCI Express 5.0 physical layer testing with an advantage in calibration and test completion time, expanding on what is already an extensive set of PCI Express test solutions. Read more...

WUHAN, China, April 13, 2020 /PRNewswire/ -- Yangtze Memory Technologies Co., Ltd (YMTC), today announced that its 128-layer 1.33Tb QLC 3D NAND flash memory chip, X2-6070, has passed sample verification on the SSD platform through co-working with multiple controller partners. As the first QLC based 128-layer 3D NAND, X2-6070 has achieved the highest bit density, highest Read more...