Precision Die Cutting

Synopsys Accelerates Cloud Computing SoC Designs with New Die-to-Die PHY IP in Advanced 7nm FinFET Process

MOUNTAIN VIEW, Calif., Oct. 29, 2019 /PRNewswire/ -- Highlights:Ultra-low power DesignWare Die-to-Die PHY IP delivers less than 1pJ/bit for optimal energy efficiency in hyperscale data centers Compact analog front-end enables reliable links up to 50 millimeters for large multi-chip module designs Flexible architecture enab Read more...

U.S. Special Die and Tool, Die Set, Jig, and Fixture Market Report 2020: Analysis and Forecast, 2007-2017 & 2020-2025

Dublin, Oct. 07, 2020 (GLOBE NEWSWIRE) -- The Read more...

Global Special Die and Tool, Die Set, Jig, and Fixture Market Report (2021 to 2030) - COVID-19 Impact and Recovery

Dublin, April 06, 2021 (GLOBE NEWSWIRE) -- The Read more...

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Synopsys Accelerates Cloud Computing SoC Designs with New Die-to-Die PHY IP in Advanced 7nm FinFET Process

U.S. Special Die and Tool, Die Set, Jig, and Fixture Market Report 2020: Analysis and Forecast, 2007-2017 & 2020-2025

Global Special Die and Tool, Die Set, Jig, and Fixture Market Report (2021 to 2030) - COVID-19 Impact and Recovery