Pune, India, April 19, 2021 (GLOBE NEWSWIRE) -- The global packaging machinery market size is predicted to reach USD 52.83 billion by 2027, exhibiting a CAGR of 3.6% during the forecast period. The unceasing demand for packaged food, drugs, and other products will contribute effectively to the growth of the market, states Fortune Business Insights, in a report, Read more...
Emerson: Emerson has introduced a new Class A, IO-Link master that provides customers with a cost-effective solution for smart and analog sensor connectivity on the AVENTICS™ Series G3 Fieldbus platform. The G3 IO-Link Master is suitable for machine architectures with many sensors and pneumatic valves, and where it’s important to have reliable digital data communication between field devices, such as sensors and the machine controller. Application areas include automotive, Read more...
