Interplex, a world leader in the design and manufacture of mechanical and interconnect products, is successfully addressing the growing market demand for high-density interconnects for challenging application scenarios. The company has just introduced its multi-row board-to-board connectors . Thanks to its patented pressure cake design, this ingenious interconnection concept will revolutionize the industry, as it allows multiple connector units to be stacked. This means that inter Read more...
ARLINGTON, Texas, Oct. 30, 2018 /PRNewswire/ -- Industrial embedded computer leader WinSystems today announced its Intel E-3800 processor-based computing platform in the Pico-ITX form factor. Measuring a mere 3.9 inches by 2.8 inches (100 mm by 72 mm), the Read more...
SAN JOSE, Calif., Nov. 6, 2018 /PRNewswire/ -- The board of directors of Intermolecular, Inc. (Nasdaq: IMI), the trusted partner for advanced materials innovation, has approved a share repurchase program pursuant to which Intermolecular may repurchase up to Read more...
