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ST. FLORIAN, Austria and FRANKFURT (ODER), Germany, Nov. 12, 2018 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP - Innovations for High Performance Microelectronics (IHP), Read more...

3M Industrial Adhesives and Tapes Division is evolving its Bonding Process Centers in St. Paul, USA; Neuss, Germany; and Shanghai, China. Against the backdrop of a growing trend toward automation in manufacturing, the 3M Bonding Process Centers provide a starting point from which to design and plan automated bonding solutions. The 3M Bonding Process Centers are designed to help identify customized process solutions to complex bonding challenges and now enable customers to also virtu Read more...

CHANDLER, Ariz., Nov. 28, 2018 /PRNewswire/ -- The recently released Defense Industrial Base Report, "Assessing and Strengthening the Manufactur Read more...