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IHP - Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temperature Covalent Wafer Bonding Technologies for Developing Next-Generation Communication Devices

ST. FLORIAN, Austria and FRANKFURT (ODER), Germany, Nov. 12, 2018 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP - Innovations for High Performance Microelectronics (IHP), Read more...

3M's Global Bonding Process Centers Help Customers Realize Their Automation Aspirations

3M Industrial Adhesives and Tapes Division is evolving its Bonding Process Centers in St. Paul, USA; Neuss, Germany; and Shanghai, China. Against the backdrop of a growing trend toward automation in manufacturing, the 3M Bonding Process Centers provide a starting point from which to design and plan automated bonding solutions. The 3M Bonding Process Centers are designed to help identify customized process solutions to complex bonding challenges and now enable customers to also virtu Read more...

3M and Nordson introduce a new automated bonding system that provides a faster, simpler, more sustainable solution for manufacturing

3M  announces the debut of 3M™ VHB™ Extrudable Tape, a new manufacturing bonding solution that brings elevated levels of automation, simplicity, and sustainability across industries. This end-to-end bonding solution combines all the benefits of 3M™ VHB™ Tapes with the versatility of a liquid adhesive in a single contained footprint enabling usage on any scale. For more than 40 years, 3M™ VHB™ Tape has redefined manufacturing design and assemb Read more...