- Compatible with High-temperature Installation on Circuit Board or in Card - NAGOYA, Japan, Nov. 8, 2018 /PRNewswire/ -- NGK INSULATORS, LTD. (hereinafter "NGK") announced on November 8 that it has developed the small, thin and high-energy-density ceramic secondary battery "EnerCera (R)" series successfully. Mass production will Read more...
SANTA CLARA, Calif., Nov. 14, 2018 /PRNewswire/ -- Achronix Semiconductor Corporation, a leader in FPGA-based hardware accelerator devices and high-performance eFPGA IP, today announced two new programs to enable research institutions, consortia, and companies full access to Achronix's leading Speedc Read more...
SAN JOSE, Calif., Nov. 28, 2018 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announces that its industry leading Thermal Test Chip (TTC) will soon be available in 8" (200mm) diameter wafers. This conversion is taking place because – Industry is better able to handle 8" wafers for bumping, thinning, and sawing Nu Read more...
