Murata Electronics Singapore Pte Ltd

Single-Layer Microchip Capacitors

Features

• Simple single-layer structure combined with fine-grained high-density ceramic, and pure gold electrode provides very reliable performance and excellent frequency characteristics.
• A wide selection of sizes from very miniature 0.25mm square is suited to high-density mounting.
• By utilizing gold electrodes, die bonding with AuSn and wire bonding with gold wire are possible.
• To improve handling of bonding, AuSn coating is available on one side or both sides.
• Custom specifications (dimensions, cap. values, etc.) are also available upon request.

Applications

Microwave integrated circuits, microwave devices, optical devices, optical transceivers, TOSA/ROSA modules, measuring equipment, etc.