Elko ep, s.r.o.

IMS technology

The market for IMS circuit boards is growing continuously.

High power losses in components require corresponding technologies for heat dissipation. This is where IMS circuit boards are used to quickly dissipate the generated heat away from the PCB surface.

IMS technology is widely used in the field of LED applications. While low-power LEDs are still mainly equipped with epoxy materials, the high-power LEDs for heat dissipation necessarily require IMS substrates in order to ensure the functionality of the module in the long run.

But in many other areas of electronics, IMS printed circuit boards are finding more and more application. We offer three different technologies at MECO. The most cost-effective variant is clearly the classic one-sided circuit board.

The following materials are commercially available.
Aluminum thickness 1.00, 1.50, 2.00, 2.50, 3.00 mm
Copper thickness 18, 35, 70, 105 μ
Dielectric 75 μ, 100 μ
Thermal conductivity WmK 1.10, 2.00, 3.00

The variant three represents the structure with an internal aluminum core. Usually the materials are pressed with normal FR4 prepregs. Dissipating the heat via the inner core is technologically the worst solution.

As an alternative to the variants two and three are also copper cores available. This has the advantage that you can also connect the metal support electrically reliable over the layers.