EoPlex, Inc., a subsidiary of ASTI Holdings, Ltd. (ASTI:SP) and developer of the world's first 3D-printed semiconductor packaging technology has announced a partnership with MCT, a leader in advanced strip testing solutions and equipment.
The CSI™ Platform is a highly customizable, versatile semiconductor packaging interconnect platform utilizing advanced deposition technology to 3D-print package components. This enables a significant cost and size reduction of QFN, QFP, and BGA packages with a marked improvement in electrical and thermal performance. Furthermore, the resulting package is readily strip testable, with incredible reductions in handling/indexing time, increase in tester utilization, and therefore huge test cost savings. The platform can also be used with multi-die, multi-chip applications in advanced packaging such as SiP and PoP.
"EoPlex 3D printing technology has the potential to disrupt and change High Volume Manufacturing (HVM) as we know it. One of the first disruptions will be in the manufacturing of very low cost and high performance semiconductor packaging for the mobility market which are strip test ready with no half-cut process step as required by traditional lead frames. We are delighted to forge a partnership with MCT to offer strip testing equipment for customers adopting the CSI™ Platform," said Robert Bagheri, EoPlex COO.
MCT is working closely with EoPlex to design and market specific advanced equipment for seamless integration into the EoPlex manufacturing process. The equipment will be available to all EoPlex customers and is slated to be available by the end of 2015.
"MCT is pleased to partner with EoPlex to support this new and exciting technology. The CSI™ Platform produces QFN strips that have electrically isolated devices, making them ideal for strip testing at final test. Customers will enjoy the dual benefits of much lower assembly costs combined with the dramatically lower costs of test due to strip testing. With CSI™ it will be simple to perform ambient, hot and cold testing using MCT's 5th generation SH-5000 Tri-Temp Strip Test Handler," said John Moon, President and CEO at MCT.
For inquiries on the CSI™ Platform or availability of equipment, contact EoPlex at firstname.lastname@example.org. For all media inquiries, contact Linda Chan at email@example.com.
About EoPlex, Inc.
EoPlex, Inc. is based in San Jose, CA, and has developed a disruptive, multi-material additive printing platform, which facilitates the manufacture of 3D-printed components for advanced products in diverse applications as batteries, fuel cell components, energy harvesters, sensors, and more. Today this platform is being used for 3D-printing semiconductor packaging interconnect. The CSI™ platform enables remarkable package designs, which provide significant reductions in cost and size while improving thermal and electrical performance. EoPlex is a subsidiary of ASTI (ASTI: SP), and is backed by ATA Ventures, Draper Fisher Jurvetson, Labrador Ventures and Draper-Richards. Visit us online at http://www.eoplex.com for more information.
About MCT Worldwide, LLC
MCT Worldwide, LLC is based in Minneapolis, MN with manufacturing operations in Penang, Malaysia. MCT is the worldwide leader in providing strip testing solutions and equipment to the semiconductor industry. MCT produces strip test handlers, film frame (or wafer ring) handlers and a laser marker to support strip test operations. Focused 100% on strip test equipment, MCT products enable customers to realize tremendous cost savings in their final test operations. MCT is now a private company that has been in business since 1972.